• Power Integrity Engineer

• Hsinchu City |    Sep 12, 2019
• 台積電 - Hsinchu City - 1. SoC/ASIC & package architecture design for high performance computing with High bandwidth Memory (Server, Networking, AI, AR…etc) applications
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• Taiwan Rdss- Assembly Packaging And Test Engineer

• Hsinchu City |    Sep 5, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Sr. Applications Engineer

• Hsinchu City |    Sep 11, 2019 Synopsys
• Synopsys - Hsinchu City - Job Description and Requirements To be the product expert to drive the success of Synopsys physical design flow and tools focusing on
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• Apr Engineer

• Hsinchu City |    Aug 29, 2019
• 台積電 - Hsinchu City - Job content: 1.Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2.Develop IC design methodology 3.Chip tape
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• Principal Application Engineer (Digital Signoff: Voltus/tempus)

• Hsinchu City |    Sep 15, 2019
• Hsinchu City - To provide key technical support in digital IC design Signoff product demonstration, and sales presentations. To demonstrate strong ability and to be
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• Product Engineer

• Hsinchu City |    Sep 5, 2019 Synopsys
• Synopsys - Hsinchu City - Job Description and Requirements Responsibilities: As Design Implementation's Library Platform product engineer (PE), you will be working
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• Apr/physical Design (Sr.) Engineer

• Hsinchu City |    Aug 6, 2019
• Hsinchu City - APR/Physical Design (Sr.) Engineer Company Nationality Taiwan Working Location HsinChu City/County Academic Background College English Proficiency
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• Logic Design (Senior) Engineer

• Hsinchu City |    Aug 2, 2019
• Hsinchu City - Logic Design (Senior) Engineer Company Nationality Taiwan Working Location HsinChu City/County Academic Background Bachelor English Proficiency
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• Cad Engineer

• Hsinchu City |    Aug 21, 2019
• 台積電 - Hsinchu City - 1.Process design kit development 2.Process design kit maintenance 3.Qualification flow automation 4.Custom design flow enablement 5.Internal
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• Physical Design Engineer/technical Manager

• Hsinchu City |    Aug 3, 2019
• Hsinchu City - Physical Design Engineer/Technical Manager Company Nationality Taiwan Working Location HsinChu City/County Academic Background Master English
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• Digital Ic Design Senior Engineer

• Hsinchu City |    Aug 3, 2019
• Hsinchu City - Digital IC Design Senior Engineer Company Nationality Taiwan Working Location HsinChu City/County Academic Background Bachelor English Proficiency
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• Senior Engineer - Design (Analog & Rf)

• Hsinchu City |    Aug 4, 2019
• Hsinchu City - Senior Engineer - Design (Analog & RF) Company Nationality USA Working Location HsinChu City/County Academic Background Master English Proficiency
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• Gan Device And Process Engineer/technical Manager

• Hsinchu City |    Aug 25, 2019
• 台積電 - Hsinchu City - 1. Design power GaN device, 2. Setup/develop the process for GaN technology 3. Solve the reliability problem 4. Design the test methodology
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• Mechanical Engineer Ii Senior - (E2)

• Hsinchu City |    Aug 14, 2019 Applied Materials
• Applied Materials - Hsinchu City - Key Responsibilities * Perform engineering analysis under general supervision Design or modify mechanical engineering layouts
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• Mtm Rd Process Integration & Device Engineers

• Hsinchu City |    Aug 22, 2019
• 台積電 - Hsinchu City - 1.Test-chip design and tape-out system developing 2.Process flow developing 3.New devices developing 4.Collaborate with related teams for
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