• Development Engineer – Mechanical Design (W/m) In Immenstaad

• Bade |    Jul 1, 2016 CENIS Consulting
• CENIS Consulting-Engineering-Service GmbH - Stuttgart, Baden-Württemberg - Anbieter: CENIS Consulting-Engineering-Service GmbH Vergütung: variables Gehalt
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• Mts Firmware Engineer

• Taipei |    Aug 18, 2016 AMD
• AMD - Taipei City - Responsibilities: 1. AMD APU/CPU/Chipset BIOS and SW support 2. Support OEM/ODM projects BIOS development and design Q&A 3. Customer platform BIOS
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• Substrate Design Engineer Ii Job

• Taichung |    Jul 9, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Mechanical Senior Engineer

• Taipei |    Jul 24, 2016 Dell
• Dell - Taipei City - Responsible for the design and development activities associated with systems, equipment and packaging. Conducts feasibility studies and
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• Structural Engineer (M/f)

• Bade |    Aug 4, 2016
• Gundelfingen, Baden-Württemberg - Structural Engineer (m/f) Envelopes in aluminium and steel made in Gundelfingen! To carry on our excellent reputation we are searching
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• Sr Substrate Design Engineer Job

• Taichung |    Jul 8, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 29547 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Engineering Director (Us Mnc)

• Taichung |    Aug 13, 2016
• Taichung City - 1. Responsible for managing various Engineering teams to develop new and improved product ideas and concepts into completed design and drawings that will
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• Mram Integration Engineer

• Hsinchu City |    Aug 14, 2016
• 台積電 - Hsinchu City - 1. MTJ device characterization 2. NVM testing and analysis 3. Integration or Defect monitor/analysis Qualifications 1. 2 years experie...
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• Sr Substrate Design Engineer Job

• Taichung |    Jul 6, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Emerging Memory Integration Engineer

• Hsinchu City |    Aug 14, 2016
• 台積電 - Hsinchu City - 1. Emerging memory technology development, responsible for process integration, wafer handling, layout design, tape-out. 2. WAT, yield, and
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• Technical Marketing Engineer - Dsm / Pdk

• Hsinchu City |    Aug 22, 2016
• 愛爾蘭商明導國際股份有限公司台灣分公司 - East District Hsinchu City - 工作說明： Job duties: Position: Technical Marketing Engineer - DSM / PDK Technical Contribution: Contribute to the
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• Talent Pipeline Program_Sr. Electrical Engineer

• Taichung |    Jul 28, 2016
• Taichung City - Job Details Job Title:Talent Pipeline Program_Sr. Electrical Engineer Description: The electrical power engineer will be responsible for the design
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• Senior Engineer Yieldstar Applications

• Hsinchu City |    Aug 17, 2016
• 台灣艾司摩爾股份有限公司(ASML) - East District Hsinchu City - 工作說明： 1. For metrology: Design targets and recipes for scatterometry based CD, overlay and focus metrology. These
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• Field Application Engineer (M/f)

• Bade |    Aug 11, 2016 ROHM Semiconductor GmbH
• ROHM Semiconductor GmbH - Stuttgart, Baden-Württemberg - ROHM Semiconductor is one of the major global semiconductor companies with over 20,000 employees. We design and
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• Developer

• Sijhih |    Aug 12, 2016
• 宏碁股份有限公司 - Xizhi, New Taipei City - Smart retail software engineer 1. Single sign-on system development 2. ID system integration 3. Smart Retail big data system
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