• Staff Substrate Design Engineer Job

• Taichung |    Dec 12, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 30030 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    Dec 8, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 30030 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Substrate Design Engineer Ii Job

• Taichung |    Jul 9, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    Jul 8, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 29547 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    Jul 6, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    May 30, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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