• Advanced Package Technology Developing Manager

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144352 As Advanced Package Technology Developing Manager, you will be responsible for building and leading a team of engineers to
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• Advanced Package Technology Developing Manager

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - As Advanced Package Technology Developing Manager, you will be responsible for building and leading a team of engineers to develop advanced
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 2, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144348 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - 3 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred Innovative with independe...
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144350 Specific Responsibilities: Advanced package technology (2.5D or 3D, FO) research and development Familiar with wafer level
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with wafer support system(carrier bonding & de
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144349 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with
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• Wafer Test Program Developer

• Taichung |    Sep 21, 2019 Micron
• Micron - Taichung City - Micron's global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the pr...
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• Rda Engineer - Advanced Package Development

• Taichung |    Sep 6, 2019 Micron
• Micron - Taichung City - Works in the advanced packaging technology development (APTD) team in Micron Taiwan Backend (MTB) at Taichung for advanced 3DI package
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• Rda Engineer - Advanced Package Development

• Taichung |    Sep 5, 2019 Micron
• Micron - Taichung City - Req. ID: 139870 Job descrption Works in the advanced packaging technology development (APTD) team in Micron Taiwan Backend (MTB) at Taichung
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• Rda Engineer - Advanced Package Development

• Taichung |    Sep 5, 2019 Micron
• Micron - Taichung City - Works in the advanced packaging technology development (APTD) team in Micron Taiwan Backend (MTB) at Taichung for advanced 3DI package
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• Development Engineer

• Taichung |    Aug 22, 2019 Corning
• Corning - Taichung City - Requisition Number: 38422 Corning is one of the world’s leading innovators in materials science. For more than 160 years, Corning has applie...
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• Development Engineer

• Taichung |    Aug 22, 2019 Corning
• Corning - Taichung City - Corning is one of the world's leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise i...
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