• Senior/principal Wafer Lamination/de-Bond Engineer - Advanced Package Development

• Taichung |    Jan 25, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology
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• Sr. Development Engineer

• Taichung |    Jan 7, 2018 Corning
• Corning - Taichung City - Corning is one of the world’s leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise...
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• Principal Wafer Edge Trim / Grind Engineer - Advanced Package Development

• Taichung |    Dec 28, 2017 Micron
• Micron - Taichung City - Req. ID: 99862 Position Description As a Senior Engineer in Micron’s Advanced Packaging Technology Development group at Taiwan Taichung, you
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• Principal Wafer Edge Trim / Grind Engineer - Advanced Package Development

• Taichung |    Dec 28, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99862 Position Description As a Senior Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
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• Software Development Manager

• Taichung |    Dec 22, 2017
• Xitun, Taichung City - Key Responsibilities 1. 8+ years of working experience in software R&D roles. 2. 3+ years of working experience in leadership roles. 3. Solid exp...
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• Software Development Manager

• Taichung |    Dec 21, 2017 Adecco
• Adecco - Xitun, Taichung City - Key Responsibilities 1. 8+ years of working experience in software R&D roles. 2. 3+ years of working experience in leadership roles. 3. ...
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• Principal Dicing Engineer- Advanced Package Development

• Taichung |    Dec 23, 2017 Micron
• Micron - Taichung City - Req. ID: 90826 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology Development
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• Principal Dicing Engineer- Advanced Package Development

• Taichung |    Dec 23, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 90826 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology
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• Senior Wet Process Engineer - Advanced Package Development

• Taichung |    Dec 16, 2017 Micron
• Micron - Taichung City - Req. ID: 89582 Micron currently has an opening for a Wet process Engineer in the Advanced Packaging Technology Development organization
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• Senior Wet Process Engineer - Advanced Package Development

• Taichung |    Dec 16, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 89582 Micron currently has an opening for a Wet process Engineer in the Advanced Packaging Technology Development
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• Tsv Assembly Manager (Taiwan) - Advanced Package Technology Development

• Taichung |    Dec 16, 2017 Micron
• Micron - Taichung City - Req. ID: 103444 As Package Process Development Manager – Technology Development, you will be responsible for building and leading a team of
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• Tsv Assembly Manager (Taiwan) - Advanced Package Technology Development

• Taichung |    Dec 16, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 103444 As Package Process Development Manager – Technology Development, you will be responsible for building and leading a
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• Senior Cvd/wafer Level Reflow Engineer - Advanced Package Development

• Taichung |    Dec 16, 2017 Micron
• Micron - Taichung City - Req. ID: 99865 As a Senior CVD/Wafer level reflow Engineer in Micron’s Advanced Packaging Technology Development group at Taiwan Taichung, you
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• Senior Cvd/wafer Level Reflow Engineer - Advanced Package Development

• Taichung |    Dec 16, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99865 As a Senior CVD/Wafer level reflow Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
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• Package Development Manager - Npi

• Taichung |    Dec 7, 2017 Micron
• Micron - Taichung City - Req. ID: 102361 As Package Development Manager - NPI, you will be responsible for leading a team of engineers to develop cost effective
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