• 2020 Campus Recruiting- Engineering Rotation Development Program (Mechanical/ Thermal/ S&v)

• Taipei |    Oct 6, 2019 Dell
• Dell - Taipei City - Engineering Rotation Development Program Mechanical/ Thermal/ S&V Engineer Ready to develop your career in a truly global and collaborative
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• 1367 Software Developer Oo/c++ - Electrical Engineering (M/f/x)

• Bade |    Oct 5, 2019 Nash Technologies Stuttgart GmbH
• Nash Technologies Stuttgart GmbH - Böblingen, Baden-Württemberg - Nash Technologies specializes in software development in embedded environments and ATE engineering in
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• Advanced Package Technology Developing Manager

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144352 As Advanced Package Technology Developing Manager, you will be responsible for building and leading a team of engineers to
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• Advanced Package Technology Developing Manager

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - As Advanced Package Technology Developing Manager, you will be responsible for building and leading a team of engineers to develop advanced
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 2, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction
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• Working Student Web/software Development (M/w/d) Javascript

• Bade |    Oct 3, 2019
• Campusjäger - Karlsruhe, Baden-Württemberg - Our innovative software enables our customers to plan their services with the help of automated delivery optimizations and ...
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144348 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - 3 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred Innovative with independe...
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144350 Specific Responsibilities: Advanced package technology (2.5D or 3D, FO) research and development Familiar with wafer level
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with wafer support system(carrier bonding & de
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144349 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with
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• Function Development For Homezone Park Assist

• Bade |    Sep 29, 2019 Bosch
• Bosch - Leonberg, Baden-Württemberg - Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industr...
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• Senior Developer (M/f/d)

• Bade |    Sep 28, 2019
• Baden-Württemberg - Referenznummer: 395229/1 Startdatum: 02/19 Projektdauer: 2 MM Ort: Baden-Württemberg Meine Aufgaben: Work in a project to develop an
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• Firmware Development Engineer - Growth Mindset - Csi / Azure - Cloud Server Infrastructure #azurehardware

• Taipei |    Oct 2, 2019 Microsoft
• Microsoft - Taipei City - We are seeking a talented firmware engineer who is passionate about delivering highly reliable and secure UEFI solutions for Microsoft Azure Clo...
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