• Senior Engineer, Packaging Engineering

• Taichung |    Jan 23, 2018 Western Digital
• Western Digital - Taichung City - Western Digital We deliver the possibilities of data. YOU define what's possible. Optimize flip chip bump pad, die bonding pad and s...
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• Staff Engineer-Smart Manufacturing

• Taichung |    Jan 26, 2018 Corning
• Corning - Taichung City - Day to Day Responsibilities:Work with and sometimes lead an integrated SME team on data platform and analytic technologies with appropriate I...
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• Aptd Operations Assistant Engineer

• Taichung |    Jan 26, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 101876 Job Description: As an APTD operations assistant engineer, you will be responsible for TSV and DRAM packaging
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• Aptd Operations Assistant Engineer

• Taichung |    Jan 26, 2018 Micron
• Micron - Taichung City - Req. ID: 101876 Job Description: As an APTD operations assistant engineer, you will be responsible for TSV and DRAM packaging process
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• Process Engineer

• Taichung |    Jan 23, 2018 Corning
• Corning - Taichung City - Internal Corning Employees are provided the opportunity to review global job openings for potential interest. However, they are encouraged to do...
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• Bod Engineer

• Taichung |    Jan 23, 2018 Corning
• Corning - Taichung City - Internal Corning Employees are provided the opportunity to review global job openings for potential interest. However, they are encouraged to do...
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• Process Engineer

• Taichung |    Jan 23, 2018 Corning
• Corning - Taichung City - Corning is one of the world’s leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise...
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• Mct Be Equipment Engineer - Keg

• Taichung |    Jan 25, 2018 Micron
• Micron - Taichung City - Req. ID: 89301 Description As an MCT BE EE KEG Engineer, you will be expected to ensure top-level equipment sourcing stages of Need, Enable
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• Mct Be Equipment Engineer - Keg

• Taichung |    Jan 25, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 89301 Description As an MCT BE EE KEG Engineer, you will be expected to ensure top-level equipment sourcing stages of
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• Package Technology And Process Development Engineer

• Taichung |    Jan 24, 2018 Micron
• Micron - Taichung City - Req. ID: 100326 Process development and Warpage tuning develop : Key responsibilities and qualities in the JD : Micron’s Advanced Package ...
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• Package Technology And Process Development Engineer

• Taichung |    Jan 24, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 100326 Process development and Warpage tuning develop : Key responsibilities and qualities in the JD : Micron's Advanced...
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• Senior/principal Wafer Lamination/de-Bond Engineer - Advanced Package Development

• Taichung |    Jan 25, 2018 Micron
• Micron - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology Development
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• Senior/principal Wafer Lamination/de-Bond Engineer - Advanced Package Development

• Taichung |    Jan 25, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology
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• Isep Engineer

• Taichung |    Jan 20, 2018
• 台積電 - Taichung City - 1. Manage the overall safety and environmental compliance program. Accountable developing and driving the implementation of safety and environ...
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• Mechanical Simulation Engineer

• Taichung |    Jan 20, 2018 Micron
• Micron - Taichung City - Req Id: 107268 As a Mechanical Simulation Engineer at Micron Technology, Inc. you will work in the R&D Package development group on thermo
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