• Jr0074429 - Assembly Packaging And Test Engineer

• Hsinchu City |    Jul 26, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0048532 - Assembly Packaging And Test Engineer

• Hsinchu City |    Feb 27, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0034900 - Package R&d Engineer

• Hsinchu City |    Aug 23, 2017 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0028821 - Package R&d Engineer

• Hsinchu City |    Jun 8, 2017 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• New Product Introduction And Hvm Mfg Process Integrator

• Hsinchu City |    Mar 17, 2016 Intel
• Intel - Hsinchu City - Job Description: The candidate will be part of the GMO Engineering Team in Taiwan, supporting Intel NSG Business Unit PMT teams in managing the
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• Manufacturing Product Engineering Manager

• Hsinchu City |    Nov 1, 2015 Intel
• Intel - Hsinchu City - Job Description: Employee will be responsible for ensuring the testability and manufacturability of both NAND component and SSD end products from n...
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• Foundry Engineering Manager

• Hsinchu City |    Dec 28, 2014 Intel
• Intel - Hsinchu City - Job Description: Plans, provides resources for and directs activities in foundry engineering function to meet schedules for new product
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