• Principal, Information Security Phl

• Taichung |    Jun 28, 2020
• Taichung City - On primary and independent basis, this role will work with each business unit to research design, scope, test, and implement various security solutions ba...
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• Principal Engineer, Packaging Engineering

• Taichung |    Apr 17, 2020 Western Digital
• Western Digital - Taichung City - Job Title: Principal Engineer, Packaging Engineering (JR-0000054119) Location: Taichung SNDK Office Job responsibilities: Perform
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 2, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction F...
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction F...
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144348 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with ch...
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - 3 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred Innovative with independe...
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144350 Specific Responsibilities: Advanced package technology (2.5D or 3D, FO) research and development Familiar with wafer level &...
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with wafer support system(carrier bonding & de-bonding...
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144349 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with wa...
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• Senior/principal New Package Developing Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Senior/Principal New Package Developing Engineer- ADVANCED PACKAGE DEVELOPMENT Apply now Start Please wait... Date: Sep 29, 2019
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• Senior/principal New Package Developing Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144351 Specific Responsibilities: Advanced package technology (2.5D or 3D, FO) research and development Familiar with wafer level &...
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• Principal Engineer, Cmp

• Taichung |    Apr 21, 2019 Micron
• Micron - Taichung City - Req. ID: 131318 Position Description As an Engineer in Micron’s Advanced Packaging Technology Development group at Taiwan Taichung, you wil...
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• Principal Engineer, Cmp

• Taichung |    Apr 21, 2019 Micron
• Micron - Taichung City - As an Engineer in Micron's Advanced Packaging Technology Development group at Taiwan Taichung, you will work in industry-leading semiconductor pr...
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• Mct Cpee Cmp Sr/principal Engineer

• Taichung |    Mar 18, 2019 Micron
• Micron - Taichung City - As an Manufacturing Central Team (MCT) Central Process and Equipment Engineering (CPEE) Senior Engineer at Micron Technology, Inc., you will be r...
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• Mct Cpee Cmp Sr/principal Engineer

• Taichung |    Mar 17, 2019 Micron
• Micron - Taichung City - Req. ID: 132483 As an Manufacturing Central Team (MCT) Central Process and Equipment Engineering (CPEE) Senior Engineer at Micron Technology, I...
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