• Principal Scientist - Process Development (M/f/d)

• Bade |    Nov 5, 2019 AGC Biologics GmbH
• AGC Biologics GmbH - Heidelberg, Baden-Württemberg - AGC Biologics, a wholly-owned subsidiary of Asahi Glass Company (AGC), is one of the industry leading CDMOs in relia...
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• Principal Product Validation Engineer

• Hsinchu City |    Nov 1, 2019 Cadence
• Cadence - Hsinchu City - At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. The Position Description is… ...
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• Senior Principal Product Engineer

• Hsinchu City |    Nov 1, 2019 Cadence
• Cadence - Hsinchu City - At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Sr Principal Product Engineer
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• Principal Application Engineer (Digital Signoff: Voltus/tempus)

• Hsinchu City |    Nov 3, 2019
• Hsinchu City - To provide key technical support in digital IC design Signoff product demonstration, and sales presentations. To demonstrate strong ability and to be hands...
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• Electrical Senior Principal Engineer

• Taipei |    Oct 19, 2019 Dell
• Dell - Taipei City - This is a Senior Electrical Principal Engineering position for Dell Precision Fix Products Major duties or responsibilities would include
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• Quality Principal Engineer (Battery)

• Taipei |    Oct 6, 2019 Dell
• Dell - Taipei City - POSITION SUMMARY: The Quality Engineer is responsible for driving continuous improvement in the quality of Dell systems, solutions, peripherals, an...
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• Sr. Principal Product Dev. Mgr

• Taipei |    Oct 3, 2019
• Taipei City - Sr. Principal Product Dev. Mgr Company Nationality USA Working Location Taipei City Academic Background Bachelor English Proficiency Business Level
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 2, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction F...
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with chip to substrate or chip to wafer interaction F...
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• Senior/principal Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144348 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with ch...
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• Firmware Principal Engineer

• Taipei |    Sep 25, 2019 Dell
• Dell - Taipei City - Firmware Principal Engineer Taipei, Taiwan Join Dell and you’ll work in a dynamic environment with other motivated, talented individuals who
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - 3 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred Innovative with independe...
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• Senior/principal Post-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144350 Specific Responsibilities: Advanced package technology (2.5D or 3D, FO) research and development Familiar with wafer level &...
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with wafer support system(carrier bonding & de-bonding...
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• Senior/principal Pre-Stacking Engineer- Advanced Package Development

• Taichung |    Oct 1, 2019 Micron
• Micron - Taichung City - Req. ID: 144349 Specific Responsibilities: Advanced package technology (chip stacking, 2.5D or 3D) research and development Familiar with wa...
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