• Principal Engineer, Asic Development Engineering

• Hsinchu |    Feb 4, 2018 Western Digital
• Western Digital - Hsinchu County - Essential Duties and responsibilities:Definition and design of test-bench and test plan for verifying Chip Level RTLDevelop complex tes...
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• Principal Design Engineer

• Taichung |    Jan 30, 2018 Jabil
• Jabil - Taichung City - Job Summary As a Principal Engineer you will have developed an expertise in a particular field of engineering or within a particular sector. You
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• Firmware Sr. Principal Engineer

• Taipei |    Jan 31, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Platform Software Sr. Principal Engineer

• Taipei |    Jan 31, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Senior Principal Engineer, Systems Development

• Taipei |    Jan 31, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Sap Concur - Principal Project Manager Job

• Taipei |    Jan 25, 2018 SAP
• SAP - Taipei City - Requisition ID: 153069 Work Area: Consulting and Professional Services Expected Travel: 0 - 100% Career Status: Professional Employment Type: Regu...
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• Principal Test Development Engineer (Eagle Test Platform)

• Hsinchu City |    Jan 25, 2018 Michael Page
• Michael Page - Hsinchu City - Develop semiconductor test plans that enable high volume\low cost solutions for production test. Detail the project tasks, schedule, and bud...
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• Senior/principal Wafer Lamination/de-Bond Engineer - Advanced Package Development

• Taichung |    Jan 25, 2018 Micron
• Micron - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology Development organiza...
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• Senior/principal Wafer Lamination/de-Bond Engineer - Advanced Package Development

• Taichung |    Jan 25, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology Developme...
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• Sr Principal Product Development Manager

• Taipei |    Jan 17, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Firmware Principal Engineer

• Taipei City |    Jan 11, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Platform Software Principal Engineer

• Taipei |    Jan 12, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Mechanical Senior Principal Engineer

• Taipei City |    Jan 11, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Senior Principal Engineer, Systems Development

• Taipei City |    Jan 11, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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• Senior Principal Product Development Manager

• Taipei |    Jan 10, 2018 Dell
• Dell - Taipei City - Why Work at Dell? Endless challenges and rewards. Opportunities on six continents. A team of colleagues fueled by collaboration. All this, and a co...
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