• Field Application Engineer

• Hsinchu City |    Oct 22, 2019 Teradyne
• Teradyne - Hsinchu City - Requisition ID 15869BR Duties & Responsibilities 1. To develop new test program/project. 2. To train users in using Teradyne testers. 3
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• Field Application Engineer

• Hsinchu City |    Oct 11, 2019 Teradyne
• Teradyne - Hsinchu City - Requisition ID 15868BR Duties & Responsibilities 1. To develop new test program/project. 2. To train users in using Teradyne testers. 3
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• Devops Architect (Fortune Global 500, Semicon Industry)

• Hsinchu City |    Oct 5, 2019 Michael Page
• Michael Page - Hsinchu City - - Leverage modern software engineering practices and principles to build safe and reliable platform services and features needed by our
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• Field Application Engineer

• Hsinchu City |    Oct 3, 2019 Teradyne
• Teradyne - Hsinchu City - Requisition ID 15810BR Duties & Responsibilities 1. To develop new test program/project. 2. To train users in using Teradyne testers. 3
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• Field Application Engineer

• Hsinchu City |    Oct 3, 2019 Teradyne
• Teradyne - Hsinchu City - Requisition ID 15745BR Duties & Responsibilities 1. To develop new test program/project. 2. To train users in using Teradyne testers. 3
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• Technical Product Support (Tps) Engineer Ii

• Hsinchu City |    Sep 11, 2019 Applied Materials
• Applied Materials - Hsinchu City - Key Responsibilities Provides systems support for engineering systems in applications or reliability labs. Supports engineering
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• Taiwan Rdss- Product Development Engineer

• Hsinchu City |    Sep 12, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Apr Design Lead/manager

• Hsinchu City |    Sep 12, 2019
• 台積電 - Hsinchu City - · You will define APR project plan/schedule with key customer and manage technical execution. · Lead an engineering team to implement chip/block
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• Taiwan Rdss- Assembly Packaging And Test Engineer

• Hsinchu City |    Sep 5, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Process Support Engineer Iii - (E3)

• Hsinchu City |    Sep 13, 2019 Applied Materials
• Applied Materials - Hsinchu City - Key Responsibilities Serves as liaison between the customer and the Business Unit for assigned projects, ensuring clear
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• Devops Architect (Fortune Global 500, Semicon Industry)

• Hsinchu City |    Aug 31, 2019 Michael Page
• Michael Page - Hsinchu City - - Leverage modern software engineering practices and principles to build safe and reliable platform services and features needed by our
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• Field Application Engineer

• Hsinchu City |    Aug 29, 2019 Teradyne
• Teradyne - Hsinchu City - Requisition ID 15674BR Duties & Responsibilities 1. To develop new test program/project. 2. To train users in using Teradyne testers. 3
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• Field Application Engineer

• Hsinchu City |    Aug 28, 2019 Teradyne
• Teradyne - Hsinchu City - Requisition ID 15673BR Duties & Responsibilities 1. To develop new test program/project. 2. To train users in using Teradyne testers. 3
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• Devops Architect (Fortune Global 500, Semicon Industry)

• Hsinchu City |    Aug 15, 2019 Michael Page
• Michael Page - Hsinchu City - - Leverage modern software engineering practices and principles to build safe and reliable platform services and features needed by our
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• Technical Project/program Management Engineer Ii - (E2)

• Hsinchu City |    Aug 3, 2019 Applied Materials
• Applied Materials - Hsinchu City - Key Responsibilities Helps to prepare project plan and coordinates project activities from planning to implementation. Maintain
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