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Technical Lead Jobs in Hsinchu

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  • Assembly Engineering & Site Manager

  • Hsinchu |    Sep 24, 2014
  • Hukou, Hsinchu County - 新竹縣湖口地區 待遇(年薪)： 面議 工作內容： -Lead and manage company's Wafer Level CSP and Flip Chip BGA Product NPIs, Product Transfers, cost reduction projects
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