• Tsv Assembly Manager (Taiwan) - Advanced Package Technology Development

• Taichung |    Dec 16, 2017 Micron
• Micron - Taichung City - Req. ID: 103444 As Package Process Development Manager – Technology Development, you will be responsible for building and leading a team of
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• Tsv Assembly Manager (Taiwan) - Advanced Package Technology Development

• Taichung |    Dec 16, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 103444 As Package Process Development Manager – Technology Development, you will be responsible for building and leading a
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• Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development

• Taichung |    Nov 18, 2017 Micron
• Micron - Taichung City - Req. ID: 100323 As a Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development you will coordinate electrical failure
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• Sr. Characterization Materials Engineer-Advanced Packaging Technology Development

• Taichung |    Nov 18, 2017 Micron
• Micron - Taichung City - Req. ID: 100324 As a Sr. Characterization Materials Engineer-Advanced Packaging Technology Development you will be responsible for global
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• Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development

• Taichung |    Nov 18, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 100323 As a Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development you will coordinate
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• Sr. Characterization Materials Engineer-Advanced Packaging Technology Development

• Taichung |    Nov 18, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 100324 As a Sr. Characterization Materials Engineer-Advanced Packaging Technology Development you will be responsible for
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• Package Technology And Process Development Engineer

• Taichung |    Nov 13, 2017 Micron
• Technology
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• Sr. Mfg Technology Engineer

• Taichung |    Aug 4, 2017 Corning
• Corning - Taichung City - Corning is one of the world’s leading innovators in materials science. For more than 160 years, Corning has applied its unparalleled expertise...
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• Package Integration Engineer - Technology Development

• Taichung |    Aug 3, 2017 Micron
• Micron - Taichung City - Req. ID: 89706 As a Package Process Integration Engineer in Micron's Advanced Packaging Technology Development Group, you will be responsible
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• 3D Assembly Process Integration Engineer - Technology Development

• Taichung |    Aug 3, 2017 Micron
• Micron - Taichung City - Req. ID: 90088 Micron currently has an opening for 3D assembly process integration engineer in the Technology Development organization located
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• Wafer Level Packaging Process Integration Engineer - Technology Development

• Taichung |    Aug 3, 2017 Micron
• Micron - Taichung City - Req. ID: 89704 Micron currently has an opening for a wafer level packaging process integration engineer in the technology development
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• Package Technology And Process Development Engineer

• Taichung |    Jul 14, 2017 Micron
• Micron - Taichung City - Req. ID: 86848 Responsibilities include but are not limited to: Develop new package technologies by engaging with Micron’s internal factories
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• Package Technology And Process Development Engineer

• Taichung |    Jul 14, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 86848 Responsibilities include but are not limited to: Develop new package technologies by engaging with Micron’s
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• It Software Engineer - Engineering And Technology Development

• Taichung |    May 5, 2017 Micron
• Micron - Taichung City - IT Software Engineer – Engineering and Technology Development We are looking for skilled, entry level Software Engineers that aspire to learn
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• Packaging Technology Development Engineer

• Taichung |    Apr 7, 2017 Micron
• Micron - Taichung City - Req Id: 64618 Responsibilities include but are not limited to: Develop new package technologies by engaging with Micron’s internal factories
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