• Jr0074429 - Assembly Packaging And Test Engineer

• Hsinchu City |    Jul 26, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0070349 - Nand Product Test R&d Engineer

• Hsinchu City |    Jun 17, 2018 Intel
• Intel - Hsinchu City - Performs research, design, and development of test equipment software, library, program flow, fixture, hardware, probing, module and/or tester for
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• Jr0070354 - Ssd Product Test R&d Engineer

• Hsinchu City |    Jun 17, 2018 Intel
• Intel - Hsinchu City - Performs research, design, and development of test equipment software, library, program flow, fixture, hardware, probing, module and/or tester for
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• Jr0048532 - Assembly Packaging And Test Engineer

• Hsinchu City |    Feb 27, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0033610 - Nand/ssd Product Test R&d Engineer

• Hsinchu City |    Sep 17, 2017 Intel
• Intel - Hsinchu City - Performs research, design, and development of test equipment software, library, program flow, fixture, hardware, probing, module and/or tester for
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• Jr0033610 - Nand/ssd Product Test R&d Engineer

• Hsinchu City |    Sep 14, 2017 Intel
• Intel - Hsinchu City - Performs research, design, and development of test equipment software, library, program flow, fixture, hardware, probing, module and/or tester for
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• Jr0031528 - Quality & Reliability Engineer

• Hsinchu City |    Sep 14, 2017 Intel
• Intel - Hsinchu City - This Quality & Reliability Engineer QRE is responsible for driving Intel's board & systems Outsource Design Manufacturers ODMs and Contract
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• Jr0031528 - Quality & Reliability Engineer

• Hsinchu City |    Aug 26, 2017 Intel
• Intel - Hsinchu City - This Quality & Reliability Engineer QRE is responsible for driving Intel's board & systems Outsource Design Manufacturers ODMs and Contract
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• Jr0034900 - Package R&d Engineer

• Hsinchu City |    Aug 23, 2017 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0034899 - Nand/ssd Product Test R&d Engineer

• Hsinchu City |    Aug 23, 2017 Intel
• Intel - Hsinchu City - Performs research, design, and development of test equipment software, library, program flow, fixture, hardware, probing, module and/or tester for
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• Jr0031528 - Ssc Odm Qre

• Hsinchu City |    Jul 16, 2017 Intel
• Intel - Hsinchu City - This Quality & Reliability Engineer QRE is responsible for driving Intel's board & systems Outsource Design Manufacturers ODMs and Contract
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• Jr0028821 - Package R&d Engineer

• Hsinchu City |    Jun 8, 2017 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0020109 - Mso Odm Qre

• Hsinchu City |    Mar 29, 2017 Intel
• Intel - Hsinchu City - This Quality & Reliability Engineer QRE is responsible for driving Intel's board & systems Outsource Design Manufacturers ODMs and Contract
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• Foundry And Product Engineer

• Hsinchu City |    Nov 1, 2016 Intel
• Intel - Hsinchu City - 1. Work closely with suppliers for technology / product qualification, ramping, customer field return, process issue solving, and all design needs
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• Foundry And Product Engineer

• Hsinchu City |    Sep 4, 2016 Intel
• Intel - Hsinchu City - 1. Work closely with suppliers for technology / product qualification, ramping, customer field return, process issue solving, and all design needs
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