• Packaging Engineer

• Hsinchu City |    May 12, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Packaging Engineer

• Hsinchu City |    Apr 22, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Yield Management Engineer

• Hsinchu City |    Mar 4, 2021 Intel
• Intel - Hsinchu City - As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders
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• Packaging Engineer

• Hsinchu City |    Mar 5, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Taiwan Rdss - Operations Management Engineer

• Hsinchu City |    Oct 10, 2020 Intel
• Intel - Hsinchu City - - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss - Foundry Product Engineer

• Hsinchu City |    Oct 7, 2020 Intel
• Intel - Hsinchu City - Intel has manufacturing business with major foundries in the world. - As a foundry product engineer, you will be conducting production data
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• Taiwan Rdss - Assembly Packaging And Test Engineer

• Hsinchu City |    Aug 5, 2020 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss- Product Development Engineer

• Hsinchu City |    Sep 12, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss- Assembly Packaging And Test Engineer

• Hsinchu City |    Sep 5, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Wafer Level Package Technology Engineer

• Hsinchu City |    Jul 6, 2019 Intel
• Intel - Hsinchu City - Technical supplier management for Wafer Level Package Technologies. Responsible to achieve and maintain yield and quality targets. Local support
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• Taiwan Rdss- Test Strategy Analyst

• Hsinchu City |    May 29, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Supply Chain Engineer

• Hsinchu City |    Feb 27, 2019 Intel
• Intel - Hsinchu City - The candidate will be part of Global Supply Management (GSM) engineering team in Taiwan, supporting Intel NSG Business Unit PMT (Production
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• Engineering Manager

• Hsinchu City |    Feb 1, 2019 Intel
• Intel - Hsinchu City - Manage a team of product engineers to enable Wafer Sort/Final Test new products @ suppliers and provide high volume manufacturing (HVM) support
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• Sr. Packaging Engineer

• Hsinchu City |    Jan 16, 2019 Intel
• Intel - Hsinchu City - The NVM Solutions Group (NSG) is seeking a Sr. Packaging Development Engineer for the development of Non-Volatile Memory package. In this role
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• Jr0075795 - Taiwan Rdss- Assembly Packaging And Test Engineer

• Hsinchu City |    Aug 5, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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