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Design Engineer Jobs in Taichung

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jobs 691 - 705 of 865
  • It Software Engineer - Ebs Apac

  • Taichung |    Apr 29, 2017 Micron
  • Micron - Taichung City - Job Description As an IT Software Engineer in the APAC Solutions Delivery team, you will be part of a project team utilizing Agile/Scrum
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  • Production/quality Engineer

  • Taichung |    Mar 18, 2017
  • Taichung City - Develop and secure the engineering and quality needs to deliver products satisfying customer expectations in all aspects of Democratic Design. Client
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  • Production/quality Engineer

  • Taichung |    Feb 24, 2017
  • Taichung City - Develop and secure the engineering and quality needs to deliver products satisfying customer expectations in all aspects of Democratic Design. Client
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  • Oi Engineer Job

  • Taichung |    Feb 21, 2017 Micron
  • Micron - Taichung City - Responsibilies: 01.Apply industrial engineering concepts to line management, capacity analysis, scheduling and production planning. 02
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  • Power Electrical Engineer

  • Taichung |    Dec 16, 2016
  • Taichung City - Job Details Job Title:Power Electrical Engineer Description: Major Responsibilities****/ Ongoing Tasks ****Design and engineering of TN 161kV
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  • Power Electrical Engineer

  • Taichung |    Dec 15, 2016
  • Taichung City - Job Details Job Title:Power Electrical Engineer Description: Major Responsibilities****/ Ongoing Tasks ****Design and engineering of TN 161kV
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  • Staff Substrate Design Engineer Job

  • Taichung |    Dec 12, 2016 SanDisk
  • SanDisk - Taichung City - Req ID: 30030 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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  • Power Electrical Engineer

  • Taichung |    Dec 12, 2016
  • Taichung City - Job Details Job Title:Power Electrical Engineer Description: Major Responsibilities****/ Ongoing Tasks ****Design and engineering of TN 161kV
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  • Sr Substrate Design Engineer Job

  • Taichung |    Dec 8, 2016 SanDisk
  • SanDisk - Taichung City - Req ID: 30030 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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