• Staff Engineer, Packaging Engineering

• Taichung |    Aug 28, 2020 Western Digital
• Western Digital - Taichung City - Perform package substrate design including FCCSP, Hybrid FC and card products. Good knowledge in flip chip die's bump lay out
  Share |  Save this job
  Share this job on -

  [x]

• Staff Engineer, Packaging Engineering

• Taichung |    May 2, 2020 Western Digital
• Western Digital - Taichung City - Job Title: Staff Engineer, Packaging Engineering Location: Taichung SNDK Office Job responsibilities: Perform package substrate
  Share |  Save this job
  Share this job on -

  [x]

• Staff Engineer, Packaging Engineering

• Taichung |    Apr 25, 2020 Western Digital
• Western Digital - Taichung City - Job Title: Principal Engineer, Packaging Engineering (JR-0000054119) Location: Taichung SNDK Office Job responsibilities: Perform
  Share |  Save this job
  Share this job on -

  [x]

• Principal Engineer, Packaging Engineering

• Taichung |    Apr 17, 2020 Western Digital
• Western Digital - Taichung City - Job Title: Principal Engineer, Packaging Engineering (JR-0000054119) Location: Taichung SNDK Office Job responsibilities: Perform
  Share |  Save this job
  Share this job on -

  [x]

• Senior Engineer, Packaging Engineering

• Taichung |    Sep 27, 2018 Western Digital
• Western Digital - Taichung City - Staff Engineer, Packaging Engineering Location: Taichung City, Taiwan Req ID: JR-0000040585 Western Digital® We deliver the
  Share |  Save this job
  Share this job on -

  [x]

• Senior Engineer, Packaging Engineering

• Taichung |    Sep 15, 2018 Western Digital
• Western Digital - Taichung City - Staff Engineer, Packaging Engineering Location: Taichung City, Taiwan Req ID: JR-0000040585 Western Digital® We deliver the
  Share |  Save this job
  Share this job on -

  [x]

• Staff Engineer, Packaging Engineering

• Taichung |    Jun 9, 2018 Western Digital
• Western Digital - Taichung City - Staff Engineer, Packaging Engineering Location: Taichung City, Taiwan Req ID: JR-0000040574 Western Digital® We deliver the
  Share |  Save this job
  Share this job on -

  [x]

• Staff Engineer, Packaging Engineering

• Taichung |    Jun 9, 2018 Western Digital
• Western Digital - Taichung City - Staff Engineer, Packaging Engineering Location: Taichung City, Taiwan Req ID: JR-0000040585 Western Digital® We deliver the
  Share |  Save this job
  Share this job on -

  [x]

• Senior Engineer, Packaging Engineering

• Taichung |    Jan 23, 2018 Western Digital
• Western Digital - Taichung City - Western Digital We deliver the possibilities of data. YOU define what's possible. Optimize flip chip bump pad, die bonding pad and s...
  Share |  Save this job
  Share this job on -

  [x]

• Senior Engineer, Packaging Engineering

• Taichung |    Dec 29, 2017 Western Digital
• Western Digital - Taichung City - Optimize die bonding pad and substrate(BGA, LGA, SIP)/ PCB layouts for possible design simplification and cost reduction of Multi-Chip
  Share |  Save this job
  Share this job on -

  [x]

• Staff Engineer, Packaging Engineering

• Taichung |    Dec 19, 2017 Western Digital
• Western Digital - Taichung City - Western Digital We deliver the possibilities of data. YOU define what's possible. Optimize flip chip bump pad, die bonding pad and s...
  Share |  Save this job
  Share this job on -

  [x]

Advertisement

---