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Engineering Jobs in Taichung

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jobs 1 - 13 of 13
  • Staff Engineer, Packaging Engineering

  • Taichung |    Aug 28, 2020 Western Digital
  • Western Digital - Taichung City - Perform package substrate design including FCCSP, Hybrid FC and card products. Good knowledge in flip chip die's bump lay out placemen...
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  • Staff Engineer, Packaging Engineering

  • Taichung |    May 2, 2020 Western Digital
  • Western Digital - Taichung City - Job Title: Staff Engineer, Packaging Engineering Location: Taichung SNDK Office Job responsibilities: Perform package substrate
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  • Staff Engineer, Packaging Engineering

  • Taichung |    Apr 25, 2020 Western Digital
  • Western Digital - Taichung City - Job Title: Principal Engineer, Packaging Engineering (JR-0000054119) Location: Taichung SNDK Office Job responsibilities: Perform
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  • Senior Engineer, Packaging Engineering

  • Taichung |    Jan 23, 2018 Western Digital
  • Western Digital - Taichung City - Western Digital We deliver the possibilities of data. YOU define what's possible. Optimize flip chip bump pad, die bonding pad and s...
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  • Senior Engineer, Packaging Engineering

  • Taichung |    Dec 29, 2017 Western Digital
  • Western Digital - Taichung City - Optimize die bonding pad and substrate(BGA, LGA, SIP)/ PCB layouts for possible design simplification and cost reduction of Multi-Chip s...
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  • Staff Engineer, Packaging Engineering

  • Taichung |    Dec 19, 2017 Western Digital
  • Western Digital - Taichung City - Western Digital We deliver the possibilities of data. YOU define what's possible. Optimize flip chip bump pad, die bonding pad and s...
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