• Design Engineer Iii (Rd)

• Taichung |    Jan 30, 2018 Jabil
• Jabil - Taichung City - Job Summary A Design Engineer III will have started focusing their engineering development toward a specific competency or industry. They will
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• Package Design Engineer

• Taichung |    Jan 20, 2018 Micron
• Micron - Taichung City - Req. ID: 107262 As a Package Design Engineer at Micron Technology, Inc. you will work in the R&D Package development group on thermo
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• Package Design Engineer

• Taichung |    Jan 20, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 107262 As a Package Design Engineer at Micron Technology, Inc. you will work in the R&D Package development group on
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• Engineering Assistant - Design Specifications

• Taichung |    Jan 20, 2018 Micron
• Micron - Taichung City - Req Id: 107266 As an Engineering Assistant - Design Specifications, your primary responsibility includes compiling product design and process
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• Design Engineer Off-The-Shelf Components

• Taichung |    Dec 21, 2017
• Taichung City - Job Summary: Facilitate qualification, development, audits, and on-time commercialization of purchased bicycle components including: seat posts, handle ba...
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• Principal Design Engineer

• Taichung |    Dec 5, 2017 Jabil
• Jabil - Taichung City - JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page. Loading... Sign In Care...
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• Principal Design Engineer

• Taichung |    Nov 17, 2017 Jabil
• Jabil - Taichung City - JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page. Loading... Sign In Care...
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• Principal Design Engineer

• Taichung |    Nov 6, 2017 Jabil
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• Principal Design Engineer

• Taichung |    Sep 13, 2017 Jabil
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• Design Engineer

• Taichung |    Jun 14, 2017 Specialized
• Specialized - Taichung City - POSITION: Design Engineer REPORTS TO: Engineering Manager SUMMARY: In this position you will work in our Engineering team
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• Staff Substrate Design Engineer Job

• Taichung |    Dec 12, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 30030 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    Dec 8, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 30030 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Substrate Design Engineer Ii Job

• Taichung |    Jul 9, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    Jul 8, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 29547 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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• Sr Substrate Design Engineer Job

• Taichung |    Jul 6, 2016 SanDisk
• SanDisk - Taichung City - Req ID: 28446 Optimize die bonding pad and substrate / PCB layouts for possible design simplification and cost reduction of Multi-Chip stack
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