Developer Jobs in Taichung
Show all jobs |
Show new jobs
jobs 1 - 15 of 28
-
Product Development Engineer
- Taichung | Mar 8, 2018 Micron Technology
- Micron Technology - Taichung City - Req. ID: 110443 SpecTek, a division of Micron Technology, Product Development Engineer Responsibilities: Plan and develop test
-
Package Development Manager - Npi
- Taichung | Feb 10, 2018 Micron Technology
- Micron Technology - Taichung City - Req. ID: 109986 As Package Development Manager - NPI, you will be responsible for leading a small team of engineers to develop cost
-
Package Technology And Process Development Engineer
- Taichung | Jan 24, 2018 Micron Technology
- Micron Technology - Taichung City - Req. ID: 100326 Process development and Warpage tuning develop : Key responsibilities and qualities in the JD : Micron's
-
Senior/principal Wafer Lamination/de-Bond Engineer - Advanced Package Development
- Taichung | Jan 25, 2018 Micron Technology
- Micron Technology - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology
-
Principal Wafer Edge Trim / Grind Engineer - Advanced Package Development
- Taichung | Dec 28, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 99862 Position Description As a Senior Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
-
Principal Dicing Engineer- Advanced Package Development
- Taichung | Dec 23, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 90826 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology
-
Senior Wet Process Engineer - Advanced Package Development
- Taichung | Dec 16, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 89582 Micron currently has an opening for a Wet process Engineer in the Advanced Packaging Technology Development
-
Tsv Assembly Manager (Taiwan) - Advanced Package Technology Development
- Taichung | Dec 16, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 103444 As Package Process Development Manager – Technology Development, you will be responsible for building and leading a
-
Senior Cvd/wafer Level Reflow Engineer - Advanced Package Development
- Taichung | Dec 16, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 99865 As a Senior CVD/Wafer level reflow Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
-
Package Development Manager - Npi
- Taichung | Dec 7, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 102361 As Package Development Manager - NPI, you will be responsible for leading a team of engineers to develop cost
-
Ecap Develop And System Maintenance Engineer
- Taichung | Dec 1, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 101682 - eCAP Development - eCAP Maintenance - WeSMART deployment - CH IS coordinator - System gating and error
-
Senior/principal Photo Coat/develop Process Engineer - Advanced Package Development
- Taichung | Nov 14, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 99863 Position Description As a Senior Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
-
Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development
- Taichung | Nov 18, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 100323 As a Sr. Characterization Electrical Engineer-Advanced Packaging Technology Development you will coordinate
-
Sr. Characterization Materials Engineer-Advanced Packaging Technology Development
- Taichung | Nov 18, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 100324 As a Sr. Characterization Materials Engineer-Advanced Packaging Technology Development you will be responsible for
-
Pre Stacking Engineer- Advanced Package Development
- Taichung | Nov 15, 2017 Micron Technology
- Micron Technology - Taichung City - Req. ID: 99870 Micron currently has an opening for a 3Di Package Development Engineer in the Advanced Packaging Technology