• Package Development Manager - Npi

• Taichung |    Feb 10, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 109986 As Package Development Manager - NPI, you will be responsible for leading a small team of engineers to develop cost
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• Mtb Adt Manager

• Taichung |    Feb 27, 2018 Micron Technology
• Micron Technology - Taichung City - Req. ID: 112002 The ADT Manager, in close collaboration with Assembly Package Technology Development(APTD) and Micron Taiwan
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• Principal Wafer Edge Trim / Grind Engineer - Advanced Package Development

• Taichung |    Dec 28, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99862 Position Description As a Senior Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
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• Package Development Manager - Npi

• Taichung |    Dec 7, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 102361 As Package Development Manager - NPI, you will be responsible for leading a team of engineers to develop cost
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• Tsv Assembly Manager (Taiwan) - Advanced Package Technology Development

• Taichung |    Dec 16, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 103444 As Package Process Development Manager – Technology Development, you will be responsible for building and leading a
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• Senior/principal Metrology Engineer - Advanced Package Development

• Taichung |    Nov 15, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99864 As a Senior Engineer in Micron's Advanced Packaging Technology Development group at Taiwan Taichung, you will be
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• Senior/principal Cmp Engineer - Advanced Package Development

• Taichung |    Nov 14, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 99862 Position Description As a Senior Engineer in Micron's Advanced Packaging Technology Development group at Taiwan
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• Senior/principal Package Integration Engineer - Advanced Package Development

• Taichung |    Sep 22, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 89706 As a Package Process Integration Engineer in Micron's Advanced Packaging Technology Development Group, you will be
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• Senior Engineer - Package Integration

• Taichung |    Oct 10, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 89706 As a Package Process Integration Engineer in Micron's Advanced Packaging Technology Development Group, you will be
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• Wafer Test Program Developer

• Taichung |    Sep 2, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 85820 Job Description: As a Wafer Sort Test Engineer at Micron Technology, Inc you will develop and maintain wafer level
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• Aptd Senior Engineer - Process Development

• Taichung |    Aug 25, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 85816 1. Job function - New process development engineering in molding technology for mobile memory packaging
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• Package Technology And Process Development Engineer

• Taichung |    Jul 14, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 86848 Responsibilities include but are not limited to: Develop new package technologies by engaging with Micron’s
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• Mtb Sig Rma Engineer

• Taichung |    Aug 10, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 90722 Description: As RMA engineer you will be responsible for the existing RMA processes, development of new RMA
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• Sig Rma Engineer

• Taichung |    Aug 9, 2017 Micron Technology
• Micron Technology - Taichung City - Req. ID: 90722 Description: As RMA engineer you will be responsible for the existing RMA processes, development of new RMA
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