• Foundry Project Manager

• Hsinchu City |    May 12, 2021 Intel
• Intel - Hsinchu City - 1. Lead internal cross-organization experts to resolve advanced technology foundry issues, product or design specific problems, and chip-package-in...
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• Project Manager

• Hsinchu City |    May 6, 2021 Intel
• Intel - Hsinchu City - 1. Lead internal cross-organization experts to resolve advanced technology foundry issues, product or design specific problems, and chip-package-in...
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• Packaging Engineer

• Hsinchu City |    May 12, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Packaging Engineer

• Hsinchu City |    Apr 22, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Packaging Engineer

• Hsinchu City |    Mar 5, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Taiwan Rdss - Operations Management Engineer

• Hsinchu City |    Oct 10, 2020 Intel
• Intel - Hsinchu City - - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss - Assembly Packaging And Test Engineer

• Hsinchu City |    Aug 5, 2020 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss- Product Development Engineer

• Hsinchu City |    Sep 12, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss- Assembly Packaging And Test Engineer

• Hsinchu City |    Sep 5, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Taiwan Rdss- Test Strategy Analyst

• Hsinchu City |    May 29, 2019 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Technical Program Manager - Pmt Leader

• Hsinchu City |    Mar 1, 2019 Intel
• Intel - Hsinchu City - Plans/manages technical programs or projects to meet specific objectives or goals. Provides leadership for the project team and key interfaces to
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• Technical Program Manager - Pmt Leader

• Hsinchu City |    Jan 2, 2019 Intel
• Intel - Hsinchu City - Plans/manages technical programs or projects to meet specific objectives or goals. Provides leadership for the project team and key interfaces to
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• Jr0081382 - Technical Program Manager - Pmt Leader

• Hsinchu City |    Oct 13, 2018 Intel
• Intel - Hsinchu City - Plans/manages technical programs or projects to meet specific objectives or goals. Provides leadership for the project team and key interfaces to
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• Jr0075795 - Taiwan Rdss- Assembly Packaging And Test Engineer

• Hsinchu City |    Aug 5, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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• Jr0074429 - Assembly Packaging And Test Engineer

• Hsinchu City |    Jul 26, 2018 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or
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