• Physical Design Engineer

• Hsinchu City |    Jul 14, 2021 Intel
• Intel - Hsinchu City - 1. Work on test chip implementation or support product implementation 2. Performs all aspects of SoC design flow from physical synthesis
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• Supply Chain Engineer

• Hsinchu City |    Jun 24, 2021 Intel
• Intel - Hsinchu City - The talent will be part of EMS, ODM Engineering team in Taiwan, supporting Intel Outsource Boards and Systems businesses. Roles will be
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• Product Engineer

• Hsinchu City |    Jun 25, 2021 Intel
• Intel - Hsinchu City - 1. Transfer Wafer Sort/Final Test NPI products and include test hardware & test program from Test Development Team to OSAT 2. Support Silicon and
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• Physical Design Engineer

• Hsinchu City |    Jun 19, 2021 Intel
• Intel - Hsinchu City - 1. Work on test chip implementation or support product implementation 2. Performs all aspects of SoC design flow from physical synthesis
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• Packaging Engineer

• Hsinchu City |    May 12, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Mechanical Engineer For Ics Testing

• Hsinchu City |    Apr 30, 2021 Intel
• Intel - Hsinchu City - Work with OSAT and equipment vendor to enable test handling/wafer probing capability for new products at OSAT Provide technical support for
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• Packaging Engineer

• Hsinchu City |    Apr 22, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Supply Chain Engineer

• Hsinchu City |    Mar 20, 2021 Intel
• Intel - Hsinchu City - 1. Working with foundry engineering teams on data analysis and logistics execution. 2. Support data extraction, transistor electrical data
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• Yield Modelling Engineer

• Hsinchu City |    Mar 19, 2021 Intel
• Intel - Hsinchu City - Responsible for production support engineering with respect to testing methods, procedures, and problem device specification and yield problems
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• Product Development Engineer

• Hsinchu City |    Mar 20, 2021 Intel
• Intel - Hsinchu City - Responsible for development and support of software capabilities for product yield analysis at various steps in manufacturing flows. Works with
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• Design For Test Engineer

• Hsinchu City |    Mar 21, 2021 Intel
• Intel - Hsinchu City - Develops and supports design for test (DFT) structures. Determines design for test approaches and develops DFT architecture. Designs and verifies
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• Design For Test Engineer

• Hsinchu City |    Mar 21, 2021 Intel
• Intel - Hsinchu City - 1) Develops and supports design for test (DFT) structures. Determines design for test approaches and develops DFT architecture. 2) Designs and
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• Packaging Engineer

• Hsinchu City |    Mar 5, 2021 Intel
• Intel - Hsinchu City - Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor
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• Supply Chain Hardware Engineer

• Hsinchu City |    Mar 5, 2021 Intel
• Intel - Hsinchu City - � Define / Support contact and probe technology � Introduce new contact/probe technology for wafer sort/Final test � Enable probing, handling and
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• Electronic Package Engineering Graduate Internship

• Hsinchu City |    Nov 14, 2020 Intel
• Intel - Hsinchu City - The Intel Optane Group (IOG) Taiwan is looking for a paid intern to help support packaging research and development projects. This position will
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